EUV-based Semiconductor Metrology for Dimensional and Materials Scaling
Abstract: Dimensional and materials scaling are two key drivers for advancing computational capabilities beyond the conventional scaling trends of the last several decades. Future device metrology solutions must be developed now without clarity as to which combinations of proposed architecture(s) and novel materials will prove best suited for integration into high-volume manufacturing. This presentation briefly reviews these possible pairings and the near-term and long-term metrology challenges as identified in the IEEE International Roadmap for Devices and Systems.


