TY - JOUR
KW - pfc
AU - H.-C. Chuang
AU - Dana Anderson
AU - V. Bright
BT - Journal of Micromechanics and Microengineering
DA - 2008-04
DO - 10.1088/0960-1317/18/4/045003
PY - 2008
EP - 045003
T2 - Journal of Micromechanics and Microengineering
TI - The fabrication of through-wafer interconnects in silicon substrates for ultra-high-vacuum atom-optics cells
VL - 18
SN - 0960-1317
ER -